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    3D Printer parts Heated Bed/Extruder Power Module Exceed Max Current 25A/30A MKS MOSFET for RAMPS 1.4 Heating-Controller
    3D Printer parts Heated Bed/Extruder Power Module Exceed Max Current 25A/30A MKS MOSFET for RAMPS 1.4 Heating-Controller 3D Printer parts Heated Bed/Extruder Power Module Exceed Max Current 25A/30A MKS MOSFET for RAMPS 1.4 Heating-Controller

    3D Printer parts Heated Bed/Extruder Power Module Exceed Max Current 25A/30A MKS MOSFET for RAMPS 1.4 Heating-Controller  32896175700

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    Estimated Delivery Time: 28-50 days
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    Item specifics
    • Model Number: 118
    • Item Type: High Power Module
    • Brand Name: Mellow
    • Product name: MOS module
    • MOSFET Transistor: semiconductor device
    • Board Size: 60mm*50mm/70mm*45mm
    • Voltage: 12-24V
    • Current: 25A/30A
    Product Description

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       Features:   Style 1: Heated bed power module Based on powerful MOSFET HA210NO6 Size: 60*50mm Mounting holes: 3.2mm diameter, for M3 screws. Distance betweeen holes: 54*43mm Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle Voltage: 12V-24V Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working    Style 2:   Size: 70*45mm Mounting holes: 3.2mm diameter, for M3 screws. Distance betweeen holes: 62.8*37.8mm Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle Voltage: 12V-50V Maximum current with active cooling: 210A This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this) Under the premise of normal cooling, it work stable under I(Max)=30A, the current must not exceed 25A while the process working   

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